Ultra-precision Machining Technologies

Ultra-precision Machining Technologies

Selected, Peer Reviewed Papers From the 8th CHINA-JAPAN International Conference on Ultra-Precision Machining, (CJUMP2011) [sic], November 20-22, 2011, Hangzhou, P.R. China

eBook - 2012
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In this collection of selected, peer-reviewed papers from a November 2011 conference, researchers in Japan and China describe current work in the field of ultra-precision machining. Major themes include single-point diamond turning, ultra-precision grinding technology, high speed machining, and machine tools and systems, as well as in-process measurement and monitoring, metrology and evaluation, finishing and polishing, micro/nano machining and fabrication, forming processes for optical and electrical components, CMP and silicon wafer processing, brittle material machining, and ultrasonic and laser machining. Some specific paper topics include precision grinding of structured tungsten carbide molds, a new approach for noncircular following grinding of a crankshaft pin, and models for predicting surface roughness in austempered ductile iron. The book contains b&w photos and images. Annotation ©2012 Book News, Inc., Portland, OR (booknews.com)

Publisher: Durnten-Zurich, Switzerland ; Enfield, NH : Trans Tech Publications, Ă2012
ISBN: 9783038138143
3038138142
3037853964
9783037853962
Characteristics: 1 online resource (xv, 399 pages) : illustrations (some color)

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